Flash Memory Cell Arrays Having Dual Control Gates Per Memory Cell Charge Storage Element

ABSTRACT

A flash NAND type EEPROM system with individual ones of an array of charge storage elements, such as floating gates, being capacitively coupled with at least two control gate lines. The control gate lines are preferably positioned between floating gates to be coupled with sidewalls of floating gates. The memory cell coupling ratio is desirably increased, as a result. Both control gate lines on opposite sides of a selected row of floating gates are usually raised to the same voltage while the second control gate lines coupled to unselected rows of floating gates immediately adjacent and on opposite sides of the selected row are kept low. The control gate lines can also be capacitively coupled with the substrate in order to selectively raise its voltage in the region of selected floating gates. The length of the floating gates and the thicknesses of the control gate lines can be made less than the minimum resolution element of the process by forming an etch mask of spacers.

CROSS REFERENCE TO RELATED APPLICATION

This is a divisional of application Ser. No. 10/791,486, filed Mar. 1,2004, which in turn is a divisional of application Ser. No. 10/282,747,filed Oct. 28, 2002, now U.S. Pat. No. 6,888,755, which applications areincorporated herein in their entirety by this reference.

FIELD OF THE INVENTION

This invention relates generally to non-volatile semiconductor memoriesof the flash EEPROM (Electrically Erasable and Programmable Read OnlyMemory) type, particularly to structures and methods of operating NANDtypes of memory cell arrays.

BACKGROUND OF THE INVENTION

There are many commercially successful non-volatile memory productsbeing used today, particularly in the form of small form factor cards,which use an array of flash EEPROM cells.

One popular flash EEPROM architecture utilizes a NAND array, wherein alarge number of strings of memory cells are connected through one ormore select transistors between individual bit lines and a referencepotential. A portion of such an array is shown in plan view in FIG. 2A.BL0-BL4 represent diffused bit line connections to global vertical metalbit lines (not shown). Although four floating gate memory cells areshown in each string, the individual strings typically include 16, 32 ormore memory cell charge storage elements, such as floating gates, in acolumn. Control gate (word) lines labeled WL0-WL3 and string selectionlines DSL and SSL extend across multiple strings over rows of floatinggates, often in polysilicon (labeled P2 in FIG. 2B, a cross-sectionalong line A-A of FIG. 2A). The control gate lines are typically formedover the floating gates as a self-aligned stack, and are capacitivelycoupled with each other through an intermediate dielectric layer 19, asshown in FIG. 2B. The top and bottom of the string connect to the bitline and a common source line respectively, commonly through atransistor using the floating gate material (P1) as its active gateelectrically driven from the periphery. This capacitive coupling betweenthe floating gate and the control gate allows the voltage of thefloating gate to be raised by increasing the voltage on the control gatecoupled thereto. An individual cell within a column is read and verifiedduring programming by causing the remaining cells in the string to beturned on hard by placing a relatively high voltage on their respectiveword lines and by placing a relatively lower voltage on the one selectedword line so that the current flowing through each string is primarilydependent only upon the level of charge stored in the addressed cellbelow the selected word line. That current typically is sensed for alarge number of strings in parallel, thereby to read charge level statesalong a row of floating gates in parallel. Examples of NAND memory cellarray architectures and their operation as part of a memory system arefound in U.S. Pat. Nos. 5,570,315, 5,774,397 and 6,046,935.

The charge storage elements of current flash EEPROM arrays are mostcommonly electrically conductive floating gates, typically formed fromdoped polysilicon material. Another type of memory cell useful in flashEEPROM systems utilizes a non-conductive dielectric material in place ofa conductive floating gate to store charge in a non-volatile manner.Such a cell is described in an article by Chan et al., “A TrueSingle-Transistor Oxide-Nitride-Oxide EEPROM Device,” IEEE ElectronDevice Letters, Vol. EDL-8, No. 3, March 1987, pp. 93-95. A triple layerdielectric formed of silicon oxide, silicon nitride and silicon oxide(“ONO”) is sandwiched between a conductive control gate and a surface ofa semi-conductive substrate above the memory cell channel. The cell isprogrammed by injecting electrons from the cell channel into thenitride, where they are trapped and stored in a limited region. Thisstored charge then changes the threshold voltage of a portion of thechannel of the cell in a manner that is detectable. The cell is erasedby injecting hot holes into the nitride. See also Nozaki et al., “A 1-MbEEPROM with MONOS Memory Cell for Semiconductor Disk Application,” IEEEJournal of Solid-State Circuits, Vol. 26, No. 4, April 1991, pp.497-501, which describes a similar cell in a split-gate configurationwhere a doped polysilicon gate extends over a portion of the memory cellchannel to form a separate select transistor.

Memory cells of a typical non-volatile flash array are divided intodiscrete blocks of cells that are erased together. That is, the blockcontains the minimum number of cells that are separately erasabletogether as an erase unit, although more than one block may be erased ina single erasing operation. Each block typically stores one or morepages of data, a page defined as the minimum number of cells that aresimultaneously subjected to a data programming and read operation as thebasic unit of programming and reading, although more than one page maybe programmed or read in a single operation. Each page typically storesone or more sectors of data, the size of the sector being defined by thehost system. An example is a sector of 512 bytes of user data, followinga standard established with magnetic disk drives, plus some number ofbytes of overhead information about the user data and/or the block inwhich it is stored.

As in most all integrated circuit applications, the pressure to shrinkthe silicon substrate area required to implement some integrated circuitfunction also exists with flash EEPROM arrays. It is continually desiredto increase the amount of digital data that can be stored in a givenarea of a silicon substrate, in order to increase the storage capacityof a given size memory card and other types of packages, or to bothincrease capacity and decrease size. Another way to increase the storagedensity of data is to store more than one bit of data per memory cellcharge storage element. This is accomplished by dividing a window of astorage element charge level voltage range into more than two states.The use of four such states allows each cell to store two bits of data,eight states stores three bits of data per cell, and so on. A multiplestate flash EEPROM structure and operation is described in U.S. Pat.Nos. 5,043,940 and 5,172,338.

The patents and articles identified above are all hereby expresslyincorporated in their entirety into this Background by these references.

SUMMARY OF THE INVENTION

A significant limitation on the continued shrinking of the size ofcurrent non-volatile memory cell arrays is the floating gate dielectric.This cannot practically be made thinner than the approximately 70Angstrom (7 nm) minimum thickness currently being used without resultingin leakage and difficulties in long term data retention. This means thatthe voltages required to be coupled to the floating gates to controlconduction in the memory cell channels below them cannot be reduced asthe size of the various gates and distances between them are reduced.Undesired coupling of voltages between the various gates increases asthe distance between them decreases unless a compensating reduction inthe voltage levels being used can be made. It is important that such areduction be made if future scaling of memory arrays is to be made.

A reduction in the level of the control gate voltages is made possibleif the coupling ratio of the floating gate can be increased. Thecoupling ratio is equal to the capacitance between the floating andcontrol gates, divided by the capacitance between the floating gate andall adjacent electrodes, most specifically the substrate, as is wellknown. The values of these capacitances depend upon the size of theopposing surface areas that are coupled, and the thickness anddielectric constants of the dielectric layers between them. Reduction ofthe coupling ratio is difficult to achieve in NAND arrays because oftheir stacked control and floating gate structures. When the couplingarea of the floating gate with the substrate is made smaller as part ofa shrink, which as a denominator could result in an increase in thecoupling ratio, the coupling area between the floating gate and thecontrol gate is similarly reduced, which causes the numerator todecrease as well.

Another undesired effect of scaling is an increase in parasiticcapacitances between conductive array elements, particularly betweenadjacent floating gates. Errors in programming or in reading the stateof one floating gate can, for example, be caused by the close proximityof the charge stored on the floating gate of an adjacent cell. Thiscoupling can create a significant number of errors in multi-stateoperation where the allowed range of threshold voltages of the floatinggate transistor that is devoted to each state is very small.

According to one primary aspect of the present invention, the memorycell array floating gates are individually coupled with at least twocontrol gates, thereby to increase the total coupling area betweenfloating and control gates without increasing the coupling area betweenthe floating gate and the substrate, thus increasing the coupling ratio.In a NAND array, the control gates usually stacked on top of rows offloating gates are replaced by control gates positioned between thefloating gates along the memory cell strings. The individual floatinggates are then capacitively coupled through opposing sidewalls to twocontrol gates, one on each side. The height of the floating gates isincreased to increase the coupling area with these control gates. Thetotal coupling area of an individual floating gate with the controlgates is significantly increased independent of the coupling areabetween the floating gate and the substrate. This allows the controlgate voltages to be significantly reduced but still results inincreasing the voltage coupled to the floating gates to the values nowused to control the memory cell channel through the gate dielectrichaving a given thickness.

In operation, the voltage of one row of floating gates is increasedduring their programming or reading by raising the voltage on thecontrol gates on both sides of the row. A similar voltage rise offloating gates in adjacent rows is reduced, even though they are alsocoupled with one of these control gates whose voltage has beenincreased, by keeping the voltage low on control gates coupled withopposite sides of these adjacent rows of floating gates.

The positioning of control gates between floating gates along NANDmemory cell strings also reduces the undesirable coupling betweenfloating gates of adjacent cells because the electrically driven controlgates tend to shield the electric field between the floating gates.Further, the control gates can be capacitively coupled to areas of thesubstrate between floating gates in order to boost the voltage of thesubstrate for certain operations such as inhibiting the programming ofindividual cells.

According to another primary aspect of the present invention, channellengths of the individual transistors in the NAND strings having a givennumber of floating gate storage elements are significantly reduced, upto almost one-half existing lengths, by forming the floating gates usingspacers having a dimension significantly less that the minimumresolution element size of the lithography being used in the process.Such spacers are formed over a layer of doped polysilicon or otherconductive material, for example, of a first dielectric material alongsides of strips of a second dielectric material. Once the seconddielectric material is removed, the spacers of the first dielectricmaterial form a mask through which the underlying conductive floatinggate material is etched. The size of the floating gates and the spacesbetween them are reduced. The control gates are preferably providedbetween the smaller floating gates and operated in the same manner asdescribed above. Smaller NAND memory cell strings result in more of thembeing formed in a given area, and a resulting increase in the density ofdata storage in a given size of memory cell array.

Additional aspects, advantages and features of the present invention areincluded in the following description of exemplary examples thereof,which description should be taken in conjunction with the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a type of memory system in which the memorycell array and operational improvements of the present invention may beimplemented;

FIG. 2A is a plan view of a prior art NAND array;

FIG. 2B is a cross-sectional view of the prior art NAND array of FIG. 2Ataken along the line A-A;

FIG. 3 is a plan view of an example memory cell array in a NANDconfiguration;

FIG. 4 is a cross-sectional view of the array of FIG. 3, taken atsection A-A thereof;

FIG. 5A is a cross-sectional view of the array of FIG. 3, taken atsection B-B thereof;

FIG. 5B is a cross-sectional view of the array of FIG. 3, taken atsection C-C thereof,

FIG. 6 is a cross-sectional view of a modified version of the array ofFIGS. 3-5, taken at section B-B, at a corresponding process stage toFIG. 5A of the first embodiment.

FIGS. 7-10 are cross-section views of sequentially formed structures ofa second embodiment of the array of FIGS. 3-5, taken at section A-A ofFIG. 3;

FIG. 11 is an enlarged cross-sectional view of a memory cell of eitherof the embodiments of FIGS. 3-5 or 7-10, to illustrate an advantagethereof;

FIG. 12 is a cross-sectional view of an alternate memory cellconstruction that may be implemented in either of the embodiments ofFIGS. 3-5 or 7-10;

FIG. 13 illustrates the capacitive coupling between gate elements andthe substrate of either of the embodiments of FIGS. 3-5 or 7-10;

FIG. 14 is an equivalent circuit diagram of a memory cell arrayaccording to either of the embodiments of FIGS. 3-5 or 7-10;

FIG. 15 is a table of example memory cell array operating conditionsthat reference the circuit diagram of FIG. 14; and

FIG. 16 is a circuit diagram of one NAND string used for illustration ofmethods of reading the NAND memory.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Memory System

An example memory system in which the various aspects of the presentinvention may be implemented is illustrated by the block diagram ofFIG. 1. A memory cell array 1 including a plurality of memory cells Marranged in a matrix is controlled by a column control circuit 2, a rowcontrol circuit 3, a c-source control circuit 4 and a c-p-well controlcircuit 5. The memory cell array 1 is, in this example, of the NAND typethat is described above in the Background and in references incorporatedherein by reference. A control circuit 2 is connected to bit lines (BL)of the memory cell array 1 for reading data stored in the memory cells(M), for determining a state of the memory cells (M) during a programoperation, and for controlling potential levels of the bit lines (BL) topromote the programming or to inhibit the programming. The row controlcircuit 3 is connected to word lines (WL) to select one of the wordlines (WL), to apply read voltages, to apply program voltages combinedwith the bit line potential levels controlled by the column controlcircuit 2, and to apply an erase voltage coupled with a voltage of ap-type region on which the memory cells (M) are formed. The c-sourcecontrol circuit 4 controls a common source line (labeled as “c-source”in FIG. 1) connected to the memory cells (M). The c-p-well controlcircuit 5 controls the c-p-well voltage.

The data stored in the memory cells (M) are read out by the columncontrol circuit 2 and are output to external I/O lines via an 1/O lineand a data input/output buffer 6. Program data to be stored in thememory cells are input to the data input/output buffer 6 via theexternal I/O lines, and transferred to the column control circuit 2. Theexternal 1/O lines are connected to a controller 9. The controller 9includes various types of registers and other memory including avolatile random-access-memory (RAM) 10.

Command data for controlling the flash memory device are inputted tocommand circuits 7 connected to external control lines that areconnected with the controller 9. The command data informs the flashmemory of what operation is requested. The input command is transferredto a state machine 8 that controls the column control circuit 2, the rowcontrol circuit 3, the c-source control circuit 4, the c-p-well controlcircuit 5 and the data input/output buffer 6. The state machine 8 canoutput a status data of the flash memory such as READY/BUSY orPASS/FAIL.

The controller 9 is connected or connectable with a host system such asa personal computer, a digital camera, or a personal digital assistant.It is the host that initiates commands, such as to store or read data toor from the memory array 1, and provides or receives such data,respectively. The controller converts such commands into command signalsthat can be interpreted and executed by the command circuits 7. Thecontroller also typically contains buffer memory for the user data beingwritten to or read from the memory array. A typical memory systemincludes one integrated circuit chip 11 that includes the controller 9,and one or more integrated circuit chips 12 that each contain a memoryarray and associated control, input/output and state machine circuits.The trend, of course, is to integrate the memory array and controllercircuits of a system together on one or more integrated circuit chips.

The memory system of FIG. 1 may be embedded as part of the host system,or may be included in a memory card that is removably insertible into amating socket of a host system. Such a card may include the entirememory system, or the controller and memory array, with associatedperipheral circuits, may be provided in separate cards. Several cardimplementations are described, for example, in U.S. Pat. No. 5,887,145,which patent is expressly incorporated herein in its entirety by thisreference.

First NAND Array Embodiment

Major components of a few memory cells of a NAND array are illustratedin plan view in FIG. 3, with an equivalent circuit thereof shown in FIG.14 where corresponding elements are indicated by the same referencenumber as in FIG. 3 but with a prime (′) added. Five strings 21-25 ofseries connected memory cells are included, with three floating gatecharge storage elements shown in each string. The string 21 includesfloating gates 27, 28 and 29, the string 22 has floating gates 30, 31and 32, the string 23 includes floating gates 33, 34 and 35, the string24 has floating gates 36, 37 and 38, and the string 25 includes floatinggates 39, 40 and 41. Only a small rectangular array of fifteen memorycells is illustrated for ease of explanation. Actual implementations ofsuch an array include millions of such memory cells in thousands of NANDstrings, each string normally having 16, 32 or more memory cells. It isunderstood that the memory array is typically positioned over one ormore well regions contained within a common substrate in order to allowthe local substrate potential of the memory array to be electricallycontrolled independent of the common substrate potential. The use of theterm “substrate” with respect to a memory array of transistorsthroughout this description will include reference to such well regionsunless specifically noted.

Each of the NAND strings 21-25 includes two select transistors, one ateach end of the string, to controllably connect the string between adifferent one of global bit lines BL0-BL4 (FIG. 14) and a referencepotential V_(S). V_(S) is normally ground during read but may assume asmall positive value during programming to assist in minimizing leakageacross the source select transistor. Voltage V_(SSL) is applied torespective gates 43-47 of select transistors T_(0S)-T_(4S) controlconnection of one end of their respective memory cell strings 21-25 toV_(S). The other ends of the strings 21-25 are connected throughrespective select transistors T_(0D)-T_(4D) (FIG. 14) to the respectivebit lines BL0-BL4 by voltage V_(DSL) applied to select transistor gates49-53. The column control circuits 2 (FIG. 1) apply a voltage to eachbit line that is representative of the specific data to be written, orsense the voltage or current during a read operation. The selecttransistors T_(0S)-T_(4S) and T_(0D)-T_(4D) (FIG. 14) include respectivesource and drain regions 55-64 and 65-74 (FIG. 3) in a semiconductorsubstrate 77 at its surface 79 (FIGS. 4, 5A and 5B).

A typical prior art NAND array includes control gate (word) linesextending across multiple strings over rows of floating gates with asuitable insulating dielectric layer therebetween. Close couplingbetween the control and floating gates is desirable, as discussed above,in order to minimize the control gate voltages that are required toraise the coupled floating gates to the voltage levels necessary forprogramming and reading their states. One control gate (word) line isused for each row of floating gates. In order to make an array with thefloating and control gates self-aligned in a y-direction (along thelengths of the NAND strings), the control gates are typically used asmasks to form the floating gates, which then have the same dimensions inthe y-direction as the control gates. There are limited opportunitieswith this architecture to increase the area of coupling between thecontrol and floating gates in order to increase the coupling ratiodiscussed above in order to enable operation with lower control gatevoltages appropriate to future scaled technologies.

Therefore, in the NAND array shown in FIGS. 3-5, control gate (word)lines 81-84 are positioned between the floating gates instead of on topof them. Each of the control gate lines extends across multiple stringsof memory cells and is capacitively coupled through a suitableinsulating dielectric, such as multi-layer oxide-nitride-oxide (ONO), tothe floating gates on both sides. Additional coupling area is obtainedby using the sidewall areas of both sides of the floating gates. Thefloating gates can be made thicker (higher) than usual in order toincrease this coupling area, and the control gates in between them arethen made to be at least as thick as the floating gates in order to takeadvantage of the added coupling area. An advantage is that this couplingarea may be controlled largely independently of the coupling area of thefloating gates and the substrate, resulting in a desirably high couplingratio even as the coupling area of the floating gates with the substrateis reduced during future shrinks.

Two of these control gate lines replace a single word line ofconventional prior art NAND arrays. For example, the word line thatwould extend across the row of floating gates 27, 30, 33, 36 and 39 in aconventional array is replaced by two control gate lines 81 and 82 (WL0and WL1). Similarly, a word line that would normally extend across therow of floating gates 28, 31, 34, 37 and 40 is replaced by two controlgate lines 82 and 83 (WL1 and WL2). The control lines 81-84 areelongated in the x-direction across the array and separated in they-direction by the length of the intervening floating gates and thethicknesses of the dielectric layers between them. Although the size ofthe memory floating gate is typically made as small as thephotolithography allows in both x and y dimensions, the channel lengthof the select transistors 43-47 and 49-53 (y-dimension) is typicallyslightly larger than the minimum feature size to ensure it caneffectively block all conduction including leakage when the maximumvoltage is applied across it.

A method of forming the array of FIG. 3, and additional features of thearray, can be explained by reference primarily to the orthogonalcross-section views of FIG. 4 (line A-A in the y-direction of FIG. 3through one string of memory cells), FIG. 5A (line B-B in thex-direction of FIG. 3 along a row of memory cells extending acrossmultiple strings), and FIG. 5B (line C-C in the x-direction of FIG. 3along a word line). After doping of the substrate 77, typicallyincluding formation of one or more wells, a layer 91 of tunnel siliconoxide (SiO₂) is grown on the surface 79 of the substrate 77 to athickness of about 8 nm. A first layer of doped polysilicon is thenformed over at least the area of the array, typically by low-pressurechemical vapor deposition (LPCVD), to a thickness of from 50 to 200 nm.from which the floating gates are later formed. This is thicker than theusual first polysilicon layer in prior art NAND devices, with the resultthat the later formed floating gates are thicker than previously. A thinpad 93 of silicon dioxide is then formed over the top of the polysiliconlayer, followed by depositing a layer 95 of silicon nitride (Si₃N₄) ofthickness typically between 100 and 300 nm. A mask is then formed on thetop of the nitride layer for etching the exposed Nitride, oxide pad,polysilicon and tunnel oxide to leave stacked strips elongated acrossthe substrate in the y-direction and separated in the x-direction by thesmallest spacing dimension resolvable by the mask formation process. Thewidth of these strips is also preferably made equal to their spacing.The etch is anisotropic and exposes the surface 79 of the substrate 77between these strips.

A next series of steps provides electrical isolation between resultingcolumns of floating gates by Shallow Trench Isolation (STI). The exposedsubstrate surface is then anisotropically etched to form trenches 97-100(FIG. 5A) elongated in the y-direction and positioned between thepolysilicon/dielectric stack strips in the x-direction. These trenchesare preferably etched to a depth of 100-300 nm. The exposed siliconsurface region may be implanted with a light Boron dose to locallyincrease the field oxide threshold voltage if needed. A thick oxidelayer is then deposited over the entire array area to completely fillthese trenches and the spaces between the polysilicon/dielectric stackedstrips. Excess oxide above the stacked strips is then removed byChemical Mechanical Polishing (CMP), down to the nitride layer 95 usedas a stop. A relatively flat surface then exists across the tops of thenitride strips 95 and thick oxide (regions 97-100 in FIG. 5A). As iswell known in the art, high temperature annealing may be employed torelieve the mechanical stress in the silicon isolation trenches as wellas to densify the thick oxide in these trenches. It is also possible toform the array without employing shallow trench isolation, for exampleby forming thick dielectric isolation above the silicon surface ratherthan in trenches etched into it.

In a next step, a mask is formed with strips extending in thex-direction, perpendicular to the polysilicon/dielectric strips justformed, between which the polysilicon/dielectric strips are removed downto the tunnel dielectric layer 91 by an anisotropic etch. The sum of thewidth of the strips of the mask and the spaces between them are made tobe as small as possible, the pitch of the process. The actual mask maybe photoresist over another deposited layer of nitride or oxide that ismasked and etched to form the masking strips in the x-direction,followed by etching the thus exposed underlying first polysilicon layerand a portion of the exposed field oxide regions. This separates theremaining strips of the first polysilicon layer into the individualfloating gates. The etch process first removes approximately 100-200 nmof exposed field oxide and then the chemistry is changed to selectivelyremove the entire exposed first polysilicon layer while stopping on theunderlying tunnel oxide. In addition to forming the floating gates, thefirst polysilicon layer can also be used to form the select transistorgates 45 and 51 as shown.

After this etch, trenches are formed alongside the first polysiliconstrips with lengths in the x-direction. Over the active regions thesetrenches will extend the full height of the floating gate plus thethickness of masking layers 93 and 95, and over the field regions theywill extend 100-200 nm as was formed during the first polysiliconseparation step described previously. It is in these trenches that thecontrol gate lines 81-84, select gates lines 80 and 85, and source andbit line contacts are formed. But before forming these control gatelines, ions are implanted in the trenches in regions noted on areas ofthe plan view of FIG. 3 that are lightly dotted. The cross-sectionalview of FIG. 4 shows such memory transistor and select gate implantedsource and drain regions 67, 72, 105, 106, 62 and 57. N+ ions maytypically be implanted with a dose within a range of 5E13-1E15. Adielectric layer 103 is then formed over the exposed surfaces of thestructure, including conforming to the sidewalls and bottom surfaces ofthe newly formed trenches. The layer 103 is preferably ONO but may alsobe a material having a higher dielectric constant.

A second layer of doped polysilicon is then deposited over the arrayarea, including completely filling the trenches and contacting thedielectric layer 103. This polysilicon is then removed from the top ofthe structure by CMP, down to the nitride layer 95 (or alternately tothe portion of ONO layer 103 immediately in contact with layer 95) thatis used as a stop, followed by a controlled etch of the polysilicon asmall distance into the trenches. This polysilicon is also removed usinga masking step from those regions of the periphery and array in whichcontacts to source & drain regions are desired. The control gate lines81-84, the SSL line 80, and the DSL line 85 are the result. These linesare made to extend at least as high as the floating gates to which theyare capacitively coupled through the dielectric layer 103.

Since these narrow control gate lines are typically driven from one endand extend over a significant portion of the memory array, their seriesresistance is of concern. Consequently the doped polysilicon may bereplaced or supplemented with a variety of materials to address thisconcern. The tops of the control gate lines may be silicided and athicker layer than normal may be used in this application since they aredefined by CMP rather than chemical etching. Alternatively, anotherconductive material, such as tungsten or molybdenum, may be used insteadof the doped second polysilicon. In yet another embodiment the controlgates can be formed as a hybrid of polysilicon capped by low resistivitymetallic interconnect. This can be accomplished for example when the topexposed surfaces of the second polysilicon control gate lines 81-84 arepartially etched down, then is coated with a thin sputtered layer of abarrier metal followed by the deposition of a metallic layer such astungsten or molybdenum. This composite layer is then etched backemploying CMP using the nitride masking layer as etch stop. Theresulting interconnect structure provides strips of narrow lowresistivity metallic word lines running in the x-direction, being inelectrical contact with the underlying second polysilicon in thetrenches, and isolated from adjacent similar word lines by the maskingdielectric layer 95 laying on top of the floating gates. FIG. 5B shows across section through section C-C of FIG. 3 at this stage of theprocess.

Next, all periphery circuits and transistors are formed, the array ofNAND strings is covered with a dielectric insulation layer (not shown),and one or more layers of standard via/metalization (aluminum or copperinterconnects) follows to provide electrical access to all bit lines,source lines, word lines and access transistors. These metalizationlayers can be used as local or global interconnects to reduce theresistivity of long word lines that may become exceedingly narrow andtherefore quite highly resistive across large memory arrays.

There are several methods of interconnecting the select gates andimplementing the source and drain contacts. One such method isillustrated in FIGS. 3-5 in which the SSL 80 and DSL 85 lines are formedfrom P2 (the same material as the word lines). The select gatetransistors use P1 as their gate material, which should be directlycontacted and not left floating. One way to accomplish this is with adirect contact between the horizontal P2 line and each P1 gate. After afirst P2 thickness is deposited, a mask is used to selectively removethe ONO layer 103 only on the side of the SSL select gate nearest thecommon source line contact and on the side of the DSL select gatenearest the bit line contact. Then a second P2 layer is deposited suchthat the combined thickness of P2 after CMP polishing and etch-back asdescribed earlier is as shown in FIG. 4. This second P2 deposition makesohmic contact with both the first P2 deposition and the P1 gate materialand allows the P2 SSL and DSL lines to directly contact the P1 gates ofthe respective select transistors. Contacts to the source selecttransistor's source region which is common to many NAND strings can bemade using a horizontal metal line (M0 79 in FIG. 3), and contacts tothe drain select transistor's drain region are made to a vertical metalline (not shown), one metal line for each column of NAND strings. Theseconnections are typically made at the same time as the interconnectionsin the periphery region. An alternate method (not shown) of makingcontact to the select gates is to use a mask to open contact regions ontop of each gate and interconnect these regions with a horizontal polyor metal line located directly above the select transistors gates, againtypically during formation of the periphery circuits andinterconnections.

Because the control gates are formed along side the floating gates, thestructure of FIGS. 3-5 has a more planar topography than the usual NANDarray. A primary advantage of this structure is the increased couplingarea between the floating gates and the control gates, which leads to animproved capacitive coupling ratio, which in turn allows lower controlgate voltages to be used during operation of the memory cell array.Additionally, positioning of the control gate lines between the floatinggates in the strings shields these floating gates from each other,thereby significantly reducing, or even eliminating, the undesirablecoupling between adjacent floating gates in the column direction. Also,as best shown in FIG. 4, the control gate lines 81-84 can becapacitively coupled through the dielectric layers 91 and 103 with theion implanted source and drain regions in the substrate 77, and thusemployed to raise (boost) the voltage of the substrate surface 79 inthese regions. The level of the ion implantation can be made less thanusual if the control gate lines are used to control the level ofconduction through the implanted regions under them, which thisstructure allows.

Additionally, and perhaps most importantly, advantage may be taken offuture reductions of the process pitch to reduce the sizes of floatinggates and other elements, and the spaces between them, even though thethickness of the floating gate oxide layer is not reduced. If thethickness of the floating gate oxide is not reduced then the voltage onthe floating gate cannot be reduced. However, if the coupling ratio orcoupling area between the floating gate and the control gate can beincreased, the control gate voltage can be reduced consistent with therequirements of the process shrink. Use of dual control gates coupled toopposing sidewalls of individual floating gates along with increasedthickness of the floating gate provides this increased coupling area.

Second NAND Array Embodiment

A modification of the memory cell array of FIGS. 3-5 is shown in FIGS.6-10, which are cross-sectional views along a NAND string in they-direction after sequential processing steps are performed. FIGS. 4 and10, of the first and second embodiments at comparable stages of theirformation, show that the number of memory cell floating gates includedin the same length of the NAND string is much higher in FIG. 10 than inFIG. 4, almost twice as many. The structures appear in the x-directionto be the same. The structure of this second embodiment has the samefeatures and advantages described above for the first embodiment, plus asignificantly smaller memory cell size in the y-direction. This isaccomplished by a novel combination of undercutting and use of spacersto form elements smaller than the smallest lithographically resolvableelement size of the process being used.

FIG. 6 shows a cross section B-B along the x-direction of the array ofFIG. 3 after a first series of processing steps to form the verticalstrips of polysilicon P1 (later to become the floating gates) separatedby the STI field oxide according to the second embodiment. The initialsteps in forming the intermediate structure of FIG. 6 are the same asdescribed above for the first embodiment as shown in FIG. 5A at acomparable stage of the process. A substrate 111 is appropriately dopedto contain one or more wells and a layer 115 of tunnel oxide is grownover a surface 113 of the substrate. A layer of doped polysilicon isthen deposited over the oxide, an oxide pad formed on its top, a nitridelayer formed over that and the polysilicon/dielectric layers then etchedinto strips extending in the y-direction. The STI trenches are thenformed between the polysilicon strips and filled with oxide. The excessoxide is removed by CMP down to the nitride layers used as a stop. Onedifference with the first embodiment is that the nitride layercorresponding to 95 of FIG. 5A has been removed from the oxide pad 119,for example using a wet etch.

Next, a relatively thick (50-200 nm.) dielectric layer 121, such asdensified silicon dioxide, is then deposited over the oxide pad 119 asshown in FIG. 7. A photoresist mask 123 is then formed over thisdielectric layer with strips extending in the x-direction, and havingwidths and spacing in the y-direction determined by the lithographicallyminimum resolvable element size. The dielectric layers 121 and 119 arethen etched through this mask. The width of the resulting strips can bemade smaller than the width of the mask strips by undercutting orover-etching sideways. Resulting relatively thick dielectric strips 121extending in the x-direction across the polysilicon strips and isolationoxide between them is narrower than the mask strips 123 through whichthey are formed. The oxide pad 119 is also removed as a result of thisetching step. This etching step is controlled in order not to removeexcessive amounts of isolation oxide between the polysilicon strips(regions 97-100 in FIG. 6).

A next series of steps are illustrated by FIG. 8. After the mask 123 isremoved, a thin (approximately 5 nm. thick) oxide pad 125 is reformed onthe surface of the polysilicon strips. This is followed by depositingsilicon nitride over the array, typically using an LPCVD process, andthen anisotropically etching the nitride to leave spacers 127 along thewalls on both sides of the oxide strips 121. The thickness of thedeposited nitride primarily determines a length L of the spacer, whichin turn (as described later) determines the length of the floatinggates, which is significantly less than the minimum width of the processbeing used to form the structure. A width W of the undercut oxide stripsand the length L of the spacers (FIG. 8) are preferably chosen to resultin substantially equal spacing of the spacers 127 along the lengths ofthe polysilicon strips 117, since (as described later) this determinesthe spacing of the resulting floating gates in the y-direction. It willalso be noted that the materials for the strips 121 and spacers 127 maybe exchanged, the strips 121 being a nitride and the spacers 127 beingan oxide, as the importance of the materials used is to allow removal byetching of the strips 121 while leaving the spacers 127 intact.

This removal and other steps are illustrated by FIGS. 8 and 9. The gapsbetween the nitride spacers 127 (FIG. 8) are first filled with oxide sothat etching away the oxide strips 121 does not result in over etchingthe field isolation oxide that is exposed between the NAND strings. CMPthen removes any excess oxide, down to tops of the nitride spacers 127used as CMP stops. This oxide between the spacers 127 and the oxidestrips 121 are then anisotropically etched together back to the topsurface of the polysilicon layer 117, which may be used as end pointdetection to terminate this oxide etch. Alternatively, to protect theexposed isolation oxide between the memory cell strings, this isolationoxide could be masked with a material that is not etched as the oxidestrips 121 are removed, and this masking material then removed after theoxide strips 121 have been removed.

A next step is to use the remaining nitride spacers 127 as a mask toseparate the polysilicon strips, such as the strip 117, into islands ofisolated floating gates. Anisotropically etching the polysilicon leavesfloating gates 131-138. The source and drain ion implantation then takesplace, using the floating gates and covering nitride spacers as a mask.The N+ ion implant dose can be within a range of from 5E13 to 1E15.Implanted regions 141-147 between the floating gates are the result. Itshould be noted that even though floating gate structures 131-138 may betall and extremely thin, they are nonetheless mechanically stable byvirtue of support from adjoining walls of the isolation oxide.

Referring to FIG. 10, a next step is the formation of a dielectric layer151 that conforms to the outside surface of the memory array, as itexists in the stage illustrated in FIG. 9. The dielectric 151 ispreferably made of ONO to a thickness of between 100 and 200 nm. Next, asecond layer of doped polysilicon is deposited by LPCVD over the arrayto completely fill the gaps between floating gates in contact with thedielectric layer 151. Excess polysilicon material is then removed by CMPback to the nitride layer material in the ONO layer 151, or, if ONO isnot used, to the tops of the nitride spacers 127 that remain as part ofthe structure. An additional polysilicon etching step is desirable inorder to remove any stringers that may remain across the nitride spacers127. The result is separate control gate lines 153-159. In order toincrease their conductivity, they may be formed and treated using any ofthe variations as described in the first embodiment. The exposed surfaceof the structure is then covered by a passivation dielectric layer,following by forming metal conductive lines and vias to connect thelines with source and drain regions at the end of the memory cellstrings, and the control gate lines along their lengths.

It can be observed from FIG. 10 that the structure of the secondembodiment has all the advantages described above for the firstembodiment, plus a higher density of floating gates along the NANDstrings. This added advantage results from making the length L of thefloating gates and space W between them smaller than the minimumdefinable lithographic feature size.

Other Features

With reference to FIG. 11, an additional advantage in the operation ofan array according to either of the first and second embodiments isillustrated. The typical NAND string, as it is further scaled down,begins to suffer more severely from edge trapping of electrons in theoxide at the side edges of the floating gate, as indicated at 161 and163. After extended cycling (programming and erasing), some tunneledelectrons remain trapped in thicker portions of the oxide immediatelyadjoining the tunnel oxide over the channel region. This trapped chargecontributes to the conduction state of the memory cell transistor; themore trapped electrons, the higher the threshold voltage during read.However, if, subsequent to programming the device is stored at arelatively high temperature (e.g. 125° C.), this oxide trapped chargemay be ejected back into the substrate. This is called “relaxation”, andcan result in a threshold voltage that is 0.3v-0.7v lower than thethreshold voltage immediately after programming. This relaxation can bea significant problem, particularly when operating at more that twostorage states per floating gate (“multi-state” or “MLC”) operation. Itcan result in data loss in all cells that have been previously heavilyprogrammed.

This relaxation effect is partially or entirely eliminated in either ofthe embodiments described above by the presence of the control gatelines (CG1 and CG2) in close proximity to the edges of tunnel dielectricat the edges of the floating gate (FG), and the high voltages applied tothese control gates during programming. This results in trapping ofelectrons outside the channel region at trapping sites that are muchdeeper into the oxide insulator, and therefore are far less susceptibleto relaxation after storage at high temperatures.

FIG. 12 illustrates a modification that may be made to either of theembodiments described above, in a cross-sectional view taken along aNAND memory cell string. The process flow may be modified to introduceshallow cavities or trenches in the active silicon between adjacentfloating gate transistors in the NAND series string. Two such trenches165 and 167 are shown in FIG. 12. The trenches are formed by etchinginto the substrate to a depth of between 20 nm to 50 nm, and isperformed after the floating gates have been formed and the exposedtunnel dielectric between them has been removed. Prior to deposition ofthe second polysilicon layer from which the control gate lines areformed, the silicon of these shallow trenches is implanted withphosphorus or arsenic, typically to a dose of between 5E13 and 1E15 at alow energy, to form source and drain regions 169 and 171.

Alternatively, a p-type doping of the memory cell channel regions of thesubstrate, which typically takes place at an initial stage of theprocessing, can be made sufficiently low that the silicon surface inthese trenches is inverted when the overlying control gate is held to aslightly positive voltage (V_(CG)>0.5V). In this alternative embodimentof field induced inversion in the source and drain regions betweenadjacent transistors in the NAND string, the control gate voltages areset at a sufficiently positive voltage to induce an inversion layeralong the surface of the trenches and therefore permit conductivitybetween adjacent floating gate transistors along the NAND string. Inthis alternative embodiment, the N+ implant into the silicon source anddrain regions along the NAND string is either at a very low dose,perhaps between 1E13 and 5E13, or is altogether omitted. Use of a fieldinduced inversion layer to facilitate electronic conduction thru theentire series NAND string outside of the floating gate transistors canfurther improve the programming and erasing cycle endurance, becauseeven a low dose of N+ implant (which is currently necessary but ishereby avoided) can cause damage to the tunnel dielectric at the edgesof the floating gate, and may therefore be preferentially avoided. Ineither case, whether or not the silicon in this trench is implanted N+or not, the boosting capacitance between the control gate lines and thesubstrate is increased substantially by virtue of this very shallowtrench, even if the lateral spacing W between adjacent floating gates isvery small.

Operation of the NAND Array Embodiments

The fundamental element of the new NAND cell structure of bothembodiments described above is the formation of two, rather than one,control gates, for each floating gate, rather than stacking the controlgate over the floating gate as is traditional. A schematicrepresentation of this is given in FIG. 13 to show the coupling betweenthe gates. Capacitive coupling C_(CF1) and C_(CF2) exists betweenopposing sidewalls of a floating gate FG and respective adjacent controlgates CG1 and CG2 on opposite sides of the floating gate. This couplingis through the ONO or other interpoly dielectric (not shown) that ispositioned between these gates. Also, capacitive coupling CFS betweenthe floating gate FG and the substrate through the tunnel dielectric(not shown). None of the control gates necessarily couples to thefloating gates from their top surfaces, as is customary in conventionalstructures. Thus most of the coupling between the two control gates andthe floating gates of each transistor is along the vertical walls thatthey share.

The capacitive coupling ratio of the floating gate transistor in the newconfiguration can be improved greatly from an increased physical heightof the floating gate and an opposing control gate. With reference toFIG. 13, the coupling ratio is approximately: $\begin{matrix}{\gamma = \frac{C_{{CF}\quad 1} + C_{{CF}\quad 2}}{C_{{CF}\quad 1} + C_{{CF}\quad 2} + C_{FS}}} & (1)\end{matrix}$

Typically, the tunnel dielectric of capacitor CFS includes an SiO₂ filmof thickness between 7 and 9 nanometers, while the dielectric ofcapacitors C_(CF1) and C_(CF2) is typically a sandwich ONO dielectricwith an oxide equivalent electrical thickness of between 14 and 18nanometers. Therefore, if the area of capacitive coupling along each ofthe two vertical walls of the floating gate is twice the area of channelcoupling, then the coupling ratio equals approximately 0.66, which isquite adequate for proper device operation. If a higher value isdesired, so that maximum program and erase voltages can be furtherdecreased, this can be readily achieved by forming all floating gateswith a greater thickness. This increases the coupling area with adjacentcontrol gates, without increasing the coupling area of the floatinggates with the substrate. The new structure provides a path to scalingdown minimum floating gate transistor feature size without reducing thecoupling ratio γ, and without the need to maintain very high program anderase voltages in highly scaled NAND devices.

Since the dual control gates are in close physical proximity to thesubstrate, a capacitive coupling C_(CS1) and C_(CS2) between each of therespective control gates CG1 and CG2 and the underlying source and drainN+ diffusions is significantly enhanced relative to the standard NANDthat has the control gate on top of the floating gate. In effect thesedual control gates also serve the function of booster plates that havebeen suggested by others to be included in addition to the floating andcontrol gates. The control gates of the NAND structures described hereinhave the same beneficial effect on channel boosting during the programinhibit mode, yet they do so without the need for a separate boosterplate with its attendant problems.

The basic operating principles of the dual gate NAND embodimentsdescribed above for erasing, programming, program inhibit, and readingare quite similar to the standard NAND structure, except that thespecific control gate (word) line voltages need to be applied to the twocontrol gates straddling the selected row of NAND transistors, one fromeither side. Furthermore, because each of the selected control gates isalso capacitively coupled to the floating gate of the NAND transistorfloating gate on its other side, capacitive coupling with appropriatevoltages on adjacent word lines has to be employed to prevent programdisturb conditions or read-inhibit conditions.

A set of exemplary voltages that perform these operations in the NANDembodiments described above is given in the table of FIG. 15. As anexample, consider that the row of floating gates 28, 31, 34, 37 and 40(FIGS. 3 and 14) is being accessed for programming. A single floatinggate capacitively coupled with two control gates results in anequivalent capacitor divider circuit. Assuming for the purpose ofillustration that each of the three capacitances of each of the floatinggates with the control gate 82, the control gate 83 and the substrate(C_(CF1), C_(CF2) and C_(FS) in FIG. 13) are equal. If 20 volts (V_(CG1)and V_(CG2)) are applied to each of the control gates lines 82 and 83and 0 volts to the substrate, then the voltage of each of the floatinggates in the row will be the sum of these three voltages (40 volts)divided by 3, or 13.3 volts Therefore, there is a voltage drop of 13.3volts across the tunnel dielectric layer separating the floating gatefrom the substrate channel region. This creates an extremely highelectric field that causes electrons to tunnel from the substratethrough the gate dielectric and onto the floating gate (Fowler-Nordheimtunneling). Note that in this discussion we are not including thevoltage contribution coming from net negative or positive charge on anyfloating gate from a previous erase or programming operation.

Programming voltages are typically applied in pulse sequences, withtypical pulse duration of several microseconds. At the same time thatthe row of floating gates 28, 31, 34, 37 and 40 is being programmed, theunselected rows of floating gates on either side of this row should notbe allowed to be affected. Floating gates 27, 30, 33, 36 and 39 are inone of these adjacent rows and floating gates 29, 32, 35, 38 and 41 inthe other (FIGS. 3 and 14). However, one side of each of these floatinggates is capacitively coupled to one of the control gates 82 and 83 thatare at 20 volts, in this example. But the opposite side of each of thesefloating gates is at the same time capacitively coupled with either ofthe control gates 81 or 84. If the voltages on these control gates areset to 2 volts and the substrate is 0 volts, the floating gate voltagesin these unselected rows will be about 7.3 volts. This voltage acrossthe floating gate oxide will be insufficient to cause electrons totunnel through the oxide from the substrate channel during theprogramming pulses.

It will be noted from the table of FIG. 15 that the voltages applied tocontrol gates not along the selected row of control gates are set todifferent voltages, depending upon whether the row is below or abovethat being programmed or read. This assumes a type of NAND in which therows are programmed sequentially in order starting from the side of thearray connected to VS. Thus, in the example of FIGS. 3 and 14, theearlier rows of floating gates below the selected are known to havealready been programmed. Similarly, in a programming operation, it isalso known that the later rows above the selected row are in the erasedstate. For proper programming, it is required that the bit line voltage(0V) be applied at the channel of the floating gate transistor beingprogrammed. This in turn requires that all series transistors in theNAND chain that are between the cell being programmed and the bit line,be turned on during this programming. This requires the correspondingcontrol gate voltages to be above 0V, typically 1V to 2V. Further,although this discussion references the array of FIGS. 3 and 14, whichare more specifically associated with the first embodiment describedabove than the second, an array according to the second embodiment isoperated in the same way.

For proper read sensing to occur, all of the unselected transistors inthe NAND should be conducting, i.e. in their “on” state, to allow properinterrogation of the one selected memory cell transistor in each stringthat is in the selected row. Assuming it requires a minimum of 3.3 volton the floating gate to ensure conduction in a memory transistorprogrammed to the highest threshold state, and that capacitances betweenfloating gate to substrate and floating gate to adjacent control gateare all equal, then the sum of the two adjacent control gate voltagesshould be a minimum of 10 volt. FIG. 16 shows one NAND string consistingof 8 transistors (T0-T7) and 9 word lines (WL0-WL8) for simplicity, butit is assumed that the actual array consists of multiple parallel NANDstrings, each with 16, 32 or more transistors as described previously inregard to FIGS. 3 and 14. Assuming multi-state transistor T4 is selectedfor reading and that the desired reading mechanism is successiveincrease of the floating gate voltage until bit line conduction isobserved, the voltage on the floating gate should be increasedsequentially from a low value to the high value (3.3 volt) in nearly asmany steps as there are states in the cell. For example, if four statesare stored in the cell, at least three voltage steps are required todifferentiate between the four states.

There are a variety of ways to satisfy this condition. One possibleapproach is to place V_(R0) volt on both of the word lines (WL4 and WL5)immediately adjacent to the selected transistor (T4), 10-V_(R0) volt onthe next adjacent word lines (WL3 and WL6) both above and below theselected cell, and continue this alternating pattern of V_(R0) volt and10-V_(R0) volt on all the remaining word lines working outward bothabove and below the selected transistor until voltages are applied toall word lines. V_(R0) is chosen as the control gate voltage that whenapplied to both of the adjacent control gates will distinguish thelowest threshold state (erase) from the lowest programmed charge storagestate (“1”). Typical values would be between 0 and 1 volt. Then the bitline current is sensed to determine presence or absence of conduction.These voltage conditions result in all unselected transistors having avoltage of 10 volt on the sum of their adjacent control gates resultingin a floating gate voltage of 3.3 volt which is above the highestpossible floating gate state and will guarantee conduction of allunselected transistors. To read the next state of the selected cell allword lines at V_(R0) volt are set to a new voltage, V_(R1), and all wordlines at 10-V_(R0) volt are set to a new voltage 10-V_(R1) and theabsence or presence of bit line current is sensed. In a similar fashionto V_(R0), V_(R1) is chosen to distinguish between the lowest programmedstate (“1”) and the next highest programmed state (“2”). This process iscontinued until all possible programmed states are sensed. This approachmaintains a constant and minimum necessary voltage on each floating gateand tends to minimize the possibility of a read disturb condition to thecharge state of all floating gates.

An alternate approach to read the selected floating gate state is toplace V_(R0) volt on both of the word lines (WL4 and WL5) immediatelyadjacent to the selected transistor (T4), 10-V_(R0) volt on the nextadjacent word lines (WL3 and WL6) both above and below the selectedcell, and 5 volts on all remaining word lines. As the voltage on theselected word lines is raised, the voltage on the two adjacent wordlines can be lowered by the same amount. This approach has the advantagethat a maximum of four control gates are being switched but has thedisadvantage that the transistors adjacent to the selected transistorare continually stressed more than necessary because their floating gatevoltage is held at 5 volts rather than 3.3 volts as in the previousapproach.

Erase by block is performed the same way as prior art NAND blocks. Allcontrol gates in a block are either at 0V (erased block) or floating(non-erased block) while the local substrate (p-well and underlyingn-well) for the entire array is raised to ˜20V.

It will be understood that the voltages shown in the table of FIG. 15are provided by way of an example only, and other voltages may workequally well or even better. For example, it may be preferable tosequence the voltages applied to the dual control gates addressing acertain floating gate, so as to avoid spiking and excessively highvoltages. Furthermore, it may be advantageous to set the specificvoltage on any control gate in the addressed NAND string to a certainvoltage level and then let it float at that voltage level during thesubsequent read, write or erase operation, relying on the capacitivecoupling that exists between every control gate word line and it'sadjacent structures to dynamically maintain the floated voltage on saidcontrol gate. This concept may be employed to use global word lines toaccess and selectively set the voltages on more than one local controlgate (word) lines. Furthermore, as the thicknesses of the variousdielectric layers adjacent to each floating gate are scaled down infuture generations, all voltages should be correspondingly scaled downto avoid excessively high electric fields with their attendantpossibility of shorts and destructive dielectric breakdown.

Conclusion

Although the various aspects of the present invention have beendescribed with respect to exemplary embodiments thereof, it will beunderstood that the present invention is entitled to protection withinthe full scope of the appended claims.

1. A non-volatile memory for programming and reading data, comprising:an array of charge storage elements positioned across a semiconductorsubstrate, a plurality of control gate lines extending across the arrayin a manner that opposing sidewalls of individual charge storageelements are capacitively coupled with at least two of the control gatelines, and a decoder and voltage supply connected to the control gatelines to couple controlled voltages to the charge storage elementscapacitively coupled therewith during programming data thereto andreading data therefrom.
 2. The memory of claim 1, wherein the controlgate lines are additionally capacitively coupled with the substrate inareas between charge storage elements.
 3. The memory of claim 2,additionally comprising trenches formed in the substrate between thecharge storage elements in the path of the control lines, the controlgate lines extending into said trenches with a dielectric layer betweenthe control lines and the substrate.
 4. The memory of claim 1, whereinthe memory cells are oriented in a plurality of series connected stringsof memory cells, and wherein the control gates extend across multiplestrings of memory cells between the charge storage elements.
 5. Thememory of claim 4, additionally comprising dielectric filled isolationtrenches in the substrate between the plurality of strings of memorycells.
 6. The memory of claim 4, wherein the control gates include acombination of doped polysilicon as a bottom portion of a height of thecontrol gates and a metal or silicide material in contact therewith as atop portion of the height of the control gates.